DAC1408D650HN-C1
vs
DAC1408D750HN
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
VFQFPN
|
QFN
|
Pin Count |
64
|
64
|
Manufacturer Package Code |
NLG64
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
JESD-609 Code |
e3
|
|
Moisture Sensitivity Level |
3
|
|
Number of Bits |
14
|
14
|
Peak Reflow Temperature (Cel) |
260
|
|
Terminal Finish |
MATTE TIN
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
2
|
2
|
Package Description |
|
HVQCCN,
|
Analog Output Voltage-Max |
|
3.47 V
|
Analog Output Voltage-Min |
|
1.8 V
|
Input Bit Code |
|
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
Input Format |
|
SERIAL
|
JESD-30 Code |
|
S-PQCC-N64
|
Length |
|
9 mm
|
Number of Functions |
|
1
|
Number of Terminals |
|
64
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
HVQCCN
|
Package Shape |
|
SQUARE
|
Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1 mm
|
Settling Time-Nom (tstl) |
|
0.02 µs
|
Supply Voltage-Nom |
|
1.8 V
|
Surface Mount |
|
YES
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
NO LEAD
|
Terminal Pitch |
|
0.5 mm
|
Terminal Position |
|
QUAD
|
Width |
|
9 mm
|
|
|
|
Compare DAC1408D650HN-C1 with alternatives
Compare DAC1408D750HN with alternatives