DAC121S101WGMPR
vs
5962R0722601V9X
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Package Description
CERAMIC, SOIC-10
DIE,
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Analog Output Voltage-Max
5.5 V
Analog Output Voltage-Min
Converter Type
D/A CONVERTER
D/A CONVERTER
Input Bit Code
BINARY
BINARY
Input Format
SERIAL
PARALLEL, WORD
JESD-30 Code
R-CDSO-G10
R-XUUC-N6
JESD-609 Code
e0
Length
6.86 mm
Linearity Error-Max (EL)
0.1953%
0.1953%
Moisture Sensitivity Level
1
Number of Bits
12
12
Number of Functions
1
1
Number of Terminals
10
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
SOP
DIE
Package Equivalence Code
SOP10,.4
DIE OR CHIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.33 mm
Settling Time-Nom (tstl)
12.5 µs
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
40
Width
6.12 mm
Base Number Matches
2
1
Screening Level
MIL-PRF-38535 Class V
Total Dose
100k Rad(Si) V
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