DAC121S101CIMMX/NOPB
vs
DAC121S101WGMPR
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
SOIC
|
|
Package Description |
TSSOP, TSSOP8,.19
|
CERAMIC, SOIC-10
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Analog Output Voltage-Max |
5.5 V
|
5.5 V
|
Analog Output Voltage-Min |
|
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
S-PDSO-G8
|
R-CDSO-G10
|
JESD-609 Code |
e3
|
e0
|
Length |
3 mm
|
6.86 mm
|
Linearity Error-Max (EL) |
0.1953%
|
0.1953%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
10
|
Operating Temperature-Max |
105 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
TSSOP
|
SOP
|
Package Equivalence Code |
TSSOP8,.19
|
SOP10,.4
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
2.33 mm
|
Settling Time-Max |
10 µs
|
|
Settling Time-Nom (tstl) |
12 µs
|
12.5 µs
|
Supply Current-Max |
0.312 mA
|
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
3 mm
|
6.12 mm
|
Base Number Matches |
1
|
2
|
ECCN Code |
|
EAR99
|
|
|
|
Compare DAC121S101CIMMX/NOPB with alternatives