DAC121C085CIMMX
vs
DAC121C085CIMMX/NOPB
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
Package Description |
MSOP-8
|
TSSOP, TSSOP8,.19
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Output Voltage-Max |
5.5 V
|
5.5 V
|
Analog Output Voltage-Min |
|
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
JESD-609 Code |
e0
|
e3
|
Length |
3 mm
|
3 mm
|
Linearity Error-Max (EL) |
0.1953%
|
0.1953%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP8,.19
|
TSSOP8,.19
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.09 mm
|
1.1 mm
|
Settling Time-Max |
8.5 µs
|
8.5 µs
|
Settling Time-Nom (tstl) |
6 µs
|
8.5 µs
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Tin/Lead (Sn85Pb15)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
SOIC
|
Pin Count |
|
8
|
Samacsys Manufacturer |
|
Texas Instruments
|
Sample Rate |
|
0.18 MHz
|
Supply Current-Max |
|
0.152 mA
|
|
|
|
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