DAC081C081CISDX/NOPB
vs
DAC081C085CIMM/NOPB
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SON
|
|
| Package Description |
HVSON, SOLCC6,.1,25
|
|
| Pin Count |
6
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Analog Output Voltage-Max |
5.5 V
|
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
|
| JESD-30 Code |
R-PDSO-N6
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2.5 mm
|
|
| Linearity Error-Max (EL) |
0.2344%
|
3.1%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
TSSOP
|
| Package Equivalence Code |
SOLCC6,.1,25
|
TSSOP8,.19
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
0.18 MHz
|
|
| Seated Height-Max |
0.8 mm
|
|
| Settling Time-Max |
4.5 µs
|
4.5 µs
|
| Settling Time-Nom (tstl) |
4.5 µs
|
|
| Supply Current-Max |
0.5 mA
|
|
| Supply Voltage-Nom |
3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
2.2 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
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