D87C51BH-24
vs
TS80C32X2-MIA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEL CORP
|
TEMIC SEMICONDUCTORS
|
| Part Package Code |
DIP
|
|
| Package Description |
WDIP,
|
PLASTIC, DIP-40
|
| Pin Count |
40
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
NO
|
NO
|
| Additional Feature |
BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION
|
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
24 MHz
|
40 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
R-GDIP-T40
|
R-PDIP-T40
|
| Length |
52.325 mm
|
|
| Number of I/O Lines |
32
|
32
|
| Number of Terminals |
40
|
40
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
WDIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE, WINDOW
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM (words) |
4096
|
|
| ROM Programmability |
UVPROM
|
|
| Seated Height-Max |
5.72 mm
|
|
| Speed |
24 MHz
|
40 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
2
|
|
|
|
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