D87C51BH-24
vs
P87C58EBPN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
WDIP,
DIP,
Pin Count
40
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Additional Feature
BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION
ON-CIRCUIT EMULATION
Address Bus Width
16
16
Bit Size
8
8
Boundary Scan
NO
NO
Clock Frequency-Max
24 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
JESD-30 Code
R-GDIP-T40
R-PDIP-T40
Length
52.325 mm
52 mm
Number of I/O Lines
32
32
Number of Terminals
40
40
On Chip Program ROM Width
8
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
PWM Channels
NO
YES
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
WDIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE
Qualification Status
Not Qualified
Not Qualified
ROM (words)
4096
32768
ROM Programmability
UVPROM
OTPROM
Seated Height-Max
5.72 mm
4.7 mm
Speed
24 MHz
8 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Format
FIXED POINT
Integrated Cache
NO
Low Power Mode
YES
Number of DMA Channels
Number of External Interrupts
2
Number of Serial I/Os
1
Number of Timers
3
On Chip Data RAM Width
8
RAM (words)
256
Supply Current-Max
32 mA
Compare D87C51BH-24 with alternatives
Compare P87C58EBPN with alternatives