D8208
vs
SN74S409-3D
feature comparison
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
INTEL CORP
|
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
|
| Pin Count |
48
|
|
| Reach Compliance Code |
compliant
|
|
| HTS Code |
8542.31.00.01
|
|
| Address Bus Width |
16
|
|
| Boundary Scan |
NO
|
|
| Bus Compatibility |
IPAX86; IPAX88; IPAX186; IPAX188
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-GDIP-T48
|
|
| Low Power Mode |
NO
|
|
| Number of Banks |
2
|
|
| Number of Terminals |
48
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
|
| Package Code |
DIP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Qualification Status |
Not Qualified
|
|
| Supply Voltage-Max |
5.25 V
|
|
| Supply Voltage-Min |
4.75 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
HMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Position |
DUAL
|
|
| uPs/uCs/Peripheral ICs Type |
MEMORY CONTROLLER, DRAM
|
|
| Base Number Matches |
1
|
|
|
|
|
Compare D8208 with alternatives