D8087-2
vs
5962-8854702QX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
DIP
Package Description
HERMETIC SEALED, CERDIP-40
DIP,
Pin Count
40
40
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
20
20
Barrel Shifter
YES
Boundary Scan
NO
NO
Bus Compatibility
8086; 8088
Clock Frequency-Max
8 MHz
5 MHz
External Data Bus Width
16
16
JESD-30 Code
R-GDIP-T40
R-CDIP-T40
Length
52.324 mm
Number of Terminals
40
40
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.715 mm
Supply Current-Max
475 mA
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
NMOS
NMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
2
1
ECCN Code
3A001.A.2.C
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
MIL-PRF-38535
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare D8087-2 with alternatives
Compare 5962-8854702QX with alternatives