D55342K07U30D1M vs D55342K07B30D1P feature comparison

D55342K07U30D1M State of the Art Inc

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D55342K07B30D1P Mini-Systems Inc (MSI)

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Part Life Cycle Code Active Active
Ihs Manufacturer STATE OF THE ART INC MINI-SYSTEMS INC
Package Description CHIP CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
JESD-609 Code e4 e0
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C -55 °C
Package Height 0.46 mm 0.457 mm
Package Length 3.2 mm 3.2 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.55 mm 1.6 mm
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C 70 °C
Reference Standard MIL-PRF-55342 MIL-PRF-55342
Resistance 30.1 Ω 30.1 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Platinum/Gold (Pt/Au) Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 100 V 100 V
Base Number Matches 2 3
Pbfree Code No
Rohs Code No
Additional Feature PRECISION
Construction Chip
Packing Method TRAY

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