D55342K07U215DP-W
vs
D55342K07G215DS
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
MINI-SYSTEMS INC
Package Description
CHIP
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
Construction
Chip
Chip
JESD-609 Code
e4
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-55 °C
Package Height
0.46 mm
0.457 mm
Package Length
3.2 mm
3.2 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
1.55 mm
1.6 mm
Packing Method
WAFFLE PACK
Tray
Rated Power Dissipation (P)
0.25 W
0.25 W
Rated Temperature
70 °C
70 °C
Reference Standard
MIL-PRF-55342
MIL-PRF-55342
Resistance
215 Ω
215 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1206
1206
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Platinum/Gold (Pt/Au)
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
100 V
100 V
Base Number Matches
1
2
Additional Feature
PRECISION
Compare D55342K07U215DP-W with alternatives
Compare D55342K07G215DS with alternatives