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D55342K07B274DR vs D55342K07U274DP feature comparison

D55342K07B274DR Mini-Systems Inc (MSI)

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D55342K07U274DP State of the Art Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Active
Ihs Manufacturer MINI-SYSTEMS INC STATE OF THE ART INC
Package Description CHIP CHIP
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature PRECISION
Construction Chip
JESD-609 Code e0 e4
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -55 °C -65 °C
Package Height 0.457 mm 0.46 mm
Package Length 3.2 mm 3.2 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.6 mm 1.55 mm
Packing Method TRAY
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C 70 °C
Reference Standard MIL-PRF-55342 MIL-PRF-55342
Resistance 274 Ω 274 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish TIN LEAD OVER NICKEL Platinum/Gold (Pt/Au)
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 100 V 100 V
Base Number Matches 3 2
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

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