D3636B-2
vs
QP7C291A-50DI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
QP SEMICONDUCTOR INC
Package Description
DIP, DIP24,.6
DIP,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
45 ns
150 ns
JESD-30 Code
R-XDIP-T24
R-GDIP-T24
JESD-609 Code
e0
Memory Density
16384 bit
524288 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Terminals
24
24
Number of Words
2048 words
2048 words
Number of Words Code
2000
64000
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2KX8
64KX8
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Part Package Code
DIP
Pin Count
24
Number of Functions
1
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Compare D3636B-2 with alternatives
Compare QP7C291A-50DI with alternatives