D3632
vs
8200803JA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEL CORP
|
QP SEMICONDUCTOR INC
|
| Package Description |
DIP, DIP24,.6
|
DIP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
50 ns
|
45 ns
|
| JESD-30 Code |
R-XDIP-T24
|
R-GDIP-T24
|
| JESD-609 Code |
e0
|
|
| Memory Density |
32768 bit
|
32768 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
8
|
8
|
| Number of Terminals |
24
|
24
|
| Number of Words |
4096 words
|
4096 words
|
| Number of Words Code |
4000
|
4000
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
4KX8
|
4KX8
|
| Package Body Material |
CERAMIC
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
5
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
24
|
| Number of Functions |
|
1
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Parallel/Serial |
|
PARALLEL
|
| Screening Level |
|
MIL-STD-883
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
|
|
|
Compare D3632 with alternatives
Compare 8200803JA with alternatives