D25XB60 vs GBJ2506-BP feature comparison

D25XB60 Shindengen Electronic Manufacturing Co Ltd

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GBJ2506-BP Micro Commercial Components

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Pbfree Code No Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer SHINDENGEN ELECTRIC MANUFACTURING CO LTD MICRO COMMERCIAL COMPONENTS CORP
Package Description 5S, SIP-4 GBJ, 4 PIN
Pin Count 4 4
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00.80
Breakdown Voltage-Min 600 V 600 V
Case Connection ISOLATED ISOLATED
Configuration BRIDGE, 4 ELEMENTS BRIDGE, 4 ELEMENTS
Diode Element Material SILICON SILICON
Diode Type BRIDGE RECTIFIER DIODE BRIDGE RECTIFIER DIODE
Forward Voltage-Max (VF) 1.1 V 1 V
JESD-30 Code R-PSFM-T4 R-PSFM-T4
JESD-609 Code e6 e3
Moisture Sensitivity Level 2 1
Non-rep Pk Forward Current-Max 350 A 350 A
Number of Elements 4 4
Number of Phases 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Output Current-Max 3.5 A 25 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Qualification Status Not Qualified Not Qualified
Reference Standard UL RECOGNIZED UL RECOGNIZED
Rep Pk Reverse Voltage-Max 600 V 600 V
Surface Mount NO NO
Terminal Finish TIN BISMUTH Matte Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Base Number Matches 7 2
Peak Reflow Temperature (Cel) 260
Reverse Current-Max 10 µA
Time@Peak Reflow Temperature-Max (s) 10

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