D25XB60 vs GBJ2506 feature comparison

D25XB60 Shindengen Electronic Manufacturing Co Ltd

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GBJ2506 HY Electronic Corp

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Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Active Contact Manufacturer
Ihs Manufacturer SHINDENGEN ELECTRIC MANUFACTURING CO LTD HY ELECTRONIC CORP
Package Description 5S, SIP-4
Pin Count 4
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00.80
Breakdown Voltage-Min 600 V 600 V
Case Connection ISOLATED
Configuration BRIDGE, 4 ELEMENTS BRIDGE, 4 ELEMENTS
Diode Element Material SILICON SILICON
Diode Type BRIDGE RECTIFIER DIODE BRIDGE RECTIFIER DIODE
Forward Voltage-Max (VF) 1.1 V 1 V
JESD-30 Code R-PSFM-T4 R-PSFM-T4
JESD-609 Code e6
Moisture Sensitivity Level 2
Non-rep Pk Forward Current-Max 350 A 350 A
Number of Elements 4 4
Number of Phases 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Output Current-Max 3.5 A 4.2 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Qualification Status Not Qualified
Reference Standard UL RECOGNIZED
Rep Pk Reverse Voltage-Max 600 V 600 V
Surface Mount NO NO
Terminal Finish TIN BISMUTH
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Base Number Matches 7 2
Operating Temperature-Min -55 °C

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