D25AP2004R75%BN
vs
RM73B2BTE4R7J
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
VISHAY INTERTECHNOLOGY INC
KOA SPEER ELECTRONICS INC
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
Construction
Chip
Film
JESD-609 Code
e4
e0
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.6 mm
Package Length
3.2 mm
3.2 mm
Package Style
SMT
SMT
Package Width
1.6 mm
1.6 mm
Packing Method
TR, Blister, 13 Inch
TR, PUNCHED PLASTIC, 7 INCH
Rated Power Dissipation (P)
0.25 W
0.25 W
Resistance
4.7 Ω
4.7 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1206
1206
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Silver/Palladium (Ag/Pd)
Tin/Lead (Sn90Pb10) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
5%
5%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Package Description
CHIP
HTS Code
8533.21.00.30
Package Shape
RECTANGULAR PACKAGE
Rated Temperature
70 °C
Reference Standard
MIL-R-55342
Series
RM73
Compare D25AP2004R75%BN with alternatives
Compare RM73B2BTE4R7J with alternatives