D11AP10022K11%BN vs RK73H1JTTDD2212F feature comparison

D11AP10022K11%BN Vishay Intertechnologies

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RK73H1JTTDD2212F KOA Speer Electronics Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer VISHAY INTERTECHNOLOGY INC KOA SPEER ELECTRONICS INC
Reach Compliance Code unknown compliant
ECCN Code EAR99
Construction Chip Rectangular
JESD-609 Code e4 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.55 mm 1.6 mm
Package Style SMT SMT
Package Width 0.85 mm 0.8 mm
Packing Method TR, Blister, 13 Inch TR, PAPER, 10 INCH
Rated Power Dissipation (P) 0.1 W 0.1 W
Resistance 22100 Ω 22100 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Silver/Palladium (Ag/Pd) MATTE TIN OVER NICKEL
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 75 V 75 V
Base Number Matches 1 1
Pbfree Code Yes
Package Description CHIP
Additional Feature PRECISION
Rated Temperature 70 °C
Reference Standard AEC-Q200

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