CYU01M16SFEU-70BVXI
vs
HYE18P16161AC-70
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
QIMONDA AG
|
Part Package Code |
BGA
|
|
Package Description |
6 X 8 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-48
|
FBGA, BGA48,6X8,30
|
Pin Count |
48
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.A
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.71
|
Access Time-Max |
70 ns
|
70 ns
|
JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B48
|
JESD-609 Code |
e1
|
|
Length |
8 mm
|
|
Memory Density |
16777216 bit
|
16777216 bit
|
Memory IC Type |
PSEUDO STATIC RAM
|
|
Memory Width |
16
|
16
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
|
Number of Terminals |
48
|
48
|
Number of Words |
1048576 words
|
1048576 words
|
Number of Words Code |
1000000
|
1000000
|
Operating Mode |
ASYNCHRONOUS
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-25 °C
|
Organization |
1MX16
|
1MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
FBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
|
Supply Voltage-Max (Vsup) |
1.95 V
|
|
Supply Voltage-Min (Vsup) |
1.7 V
|
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.75 mm
|
0.75 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
6 mm
|
|
Base Number Matches |
1
|
2
|
I/O Type |
|
COMMON
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
BGA48,6X8,30
|
Standby Current-Max |
|
0.000025 A
|
Standby Voltage-Min |
|
1.7 V
|
Supply Current-Max |
|
0.02 mA
|
|
|
|
Compare CYU01M16SFEU-70BVXI with alternatives