CYP15G04K100V1-MGC
vs
CYP15G0403DXB-BGC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
BGA,
BGA-256
Pin Count
456
256
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B456
S-PBGA-B256
Length
35 mm
27 mm
Number of Functions
1
1
Number of Terminals
456
256
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
HBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, HEAT SINK/SLUG
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.46 mm
1.745 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
TELECOM CIRCUIT
ETHERNET TRANSCEIVER
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
27 mm
Base Number Matches
1
1
Rohs Code
Data Rate
1500000 Mbps
JESD-609 Code
e0
Moisture Sensitivity Level
3
Number of Transceivers
4
Package Equivalence Code
BGA256,20X20,50
Supply Current-Max
1.32 mA
Technology
BICMOS
Terminal Finish
TIN LEAD
Compare CYP15G04K100V1-MGC with alternatives
Compare CYP15G0403DXB-BGC with alternatives