CYP15G0401RB-BGI
vs
CYP15G0401DXB-BGXI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, 1.57 MM HEIGHT, BGA-256
Pin Count
256
256
Reach Compliance Code
unknown
compliant
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
Length
27 mm
27 mm
Moisture Sensitivity Level
NOT SPECIFIED
3
Number of Functions
1
1
Number of Terminals
256
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
HBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.745 mm
1.745 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
BICMOS
BICMOS
Telecom IC Type
TELECOM CIRCUIT
ETHERNET TRANSCEIVER
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
20
Width
27 mm
27 mm
Base Number Matches
2
2
ECCN Code
5A991.B.1
HTS Code
8542.39.00.01
Data Rate
1500000 Mbps
Number of Transceivers
4
Package Equivalence Code
BGA256,20X20,50
Supply Current-Max
1.1 mA
Compare CYP15G0401DXB-BGXI with alternatives