CYM26KAH24AV33-10BGC vs GS76024AGB-10T feature comparison

CYM26KAH24AV33-10BGC Cypress Semiconductor

Buy Now Datasheet

GS76024AGB-10T GSI Technology

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 BGA,
Pin Count 119 119
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 10 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e1
Length 22 mm 22 mm
Memory Density 6291456 bit 6291456 bit
Memory IC Type SRAM MODULE STANDARD SRAM
Memory Width 24 24
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX24 256KX24
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 1.99 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.18 mA
Supply Voltage-Max (Vsup) 3.465 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Pbfree Code Yes
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260

Compare CYM26KAH24AV33-10BGC with alternatives

Compare GS76024AGB-10T with alternatives