CYM1464PD-35C vs 5962-9560002MXX feature comparison

CYM1464PD-35C Cypress Semiconductor

Buy Now Datasheet

5962-9560002MXX Microsemi Corporation

Buy Now
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP MICROSEMI CORP
Part Package Code MODULE DIP
Package Description MODULE, DIP-32 DIP,
Pin Count 32 32
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.A 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
I/O Type COMMON
JESD-30 Code R-XDMA-T32 R-GDIP-T32
JESD-609 Code e0
Memory Density 4194304 bit 4194304 bit
Memory IC Type SRAM MODULE STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8 512KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.01 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.3 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 5

Compare CYM1464PD-35C with alternatives

Compare 5962-9560002MXX with alternatives