CYDD18S72V18-200BBI
vs
CYD18S72V18-167BBXI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484
23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484
Pin Count
484
484
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
9 ns
4 ns
Additional Feature
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V.
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e0
e1
Length
23 mm
23 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
72
72
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
484
484
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX72
256KX72
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.16 mm
2.16 mm
Supply Voltage-Max (Vsup)
1.58 V
1.58 V
Supply Voltage-Min (Vsup)
1.42 V
1.42 V
Supply Voltage-Nom (Vsup)
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
23 mm
23 mm
Base Number Matches
1
3
Compare CYDD18S72V18-200BBI with alternatives
Compare CYD18S72V18-167BBXI with alternatives