CYDD09S72V18-167BBI
vs
CYDD09S72V18-167BGXI
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484
|
23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484
|
| Pin Count |
484
|
484
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
11 ns
|
9 ns
|
| Additional Feature |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V.
|
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V
|
| JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B484
|
| JESD-609 Code |
e0
|
e1
|
| Length |
23 mm
|
23 mm
|
| Memory Density |
9437184 bit
|
9437184 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
72
|
72
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
484
|
484
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
128KX72
|
128KX72
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.16 mm
|
2.16 mm
|
| Supply Voltage-Max (Vsup) |
1.58 V
|
1.58 V
|
| Supply Voltage-Min (Vsup) |
1.42 V
|
1.42 V
|
| Supply Voltage-Nom (Vsup) |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
20
|
| Width |
23 mm
|
23 mm
|
| Base Number Matches |
1
|
1
|
| Clock Frequency-Max (fCLK) |
|
167 MHz
|
| I/O Type |
|
COMMON
|
| Number of Ports |
|
2
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
BGA484,22X22,40
|
| Standby Current-Max |
|
0.22 A
|
| Standby Voltage-Min |
|
1.5 V
|
| Supply Current-Max |
|
0.83 mA
|
|
|
|
Compare CYDD09S72V18-167BBI with alternatives
Compare CYDD09S72V18-167BGXI with alternatives