CYDD04S18V18-167BBC
vs
70V7599S133BCI8
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
BGA
|
CABGA
|
Package Description |
17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256
|
17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
|
Pin Count |
256
|
256
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
9 ns
|
15 ns
|
Additional Feature |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V
|
PIPELINED OR FLOW-THROUGH ARCHITECTURE
|
Clock Frequency-Max (fCLK) |
167 MHz
|
133 MHz
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e0
|
e0
|
Length |
17 mm
|
17 mm
|
Memory Density |
4718592 bit
|
4718592 bit
|
Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
Memory Width |
36
|
36
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
256
|
256
|
Number of Words |
131072 words
|
131072 words
|
Number of Words Code |
128000
|
128000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
128KX36
|
128KX36
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
225
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Standby Current-Max |
0.15 A
|
0.04 A
|
Standby Voltage-Min |
1.5 V
|
3.15 V
|
Supply Current-Max |
0.52 mA
|
0.675 mA
|
Supply Voltage-Max (Vsup) |
1.58 V
|
3.45 V
|
Supply Voltage-Min (Vsup) |
1.42 V
|
3.15 V
|
Supply Voltage-Nom (Vsup) |
1.5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
20
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
1
|
2
|
Manufacturer Package Code |
|
BC256
|
|
|
|
Compare CYDD04S18V18-167BBC with alternatives
Compare 70V7599S133BCI8 with alternatives