CYD18S72V18-200BBXC
vs
CYDD18S72V18-200BBXC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INFINEON TECHNOLOGIES AG
CYPRESS SEMICONDUCTOR CORP
Package Description
23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484
23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484
Reach Compliance Code
compliant
compliant
Access Time-Max
3.3 ns
9 ns
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e1
e1
Length
23 mm
23 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
72
72
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
484
484
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX72
256KX72
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.16 mm
2.16 mm
Supply Voltage-Max (Vsup)
1.58 V
1.58 V
Supply Voltage-Min (Vsup)
1.42 V
1.42 V
Supply Voltage-Nom (Vsup)
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
23 mm
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
484
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Additional Feature
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V.
Compare CYD18S72V18-200BBXC with alternatives
Compare CYDD18S72V18-200BBXC with alternatives