CYD02S36V-167BBC
vs
70T3539MS133BCG
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
BGA
|
CABGA
|
Package Description |
17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256
|
17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
|
Pin Count |
256
|
256
|
Reach Compliance Code |
unknown
|
compliant
|
Access Time-Max |
4.4 ns
|
15 ns
|
Additional Feature |
PIPELINED ARCHITECTURE
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
17 mm
|
|
Memory Density |
2359296 bit
|
18874368 bit
|
Memory IC Type |
DUAL-PORT SRAM
|
APPLICATION SPECIFIC SRAM
|
Memory Width |
36
|
36
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
256
|
Number of Words |
65536 words
|
524288 words
|
Number of Words Code |
64000
|
512000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
64KX36
|
512KX36
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
|
Supply Voltage-Max (Vsup) |
1.9 V
|
2.6 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
2.4 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
NOT SPECIFIED
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Manufacturer Package Code |
|
BCG256
|
ECCN Code |
|
3A991.B.2.A
|
HTS Code |
|
8542.32.00.41
|
Clock Frequency-Max (fCLK) |
|
133 MHz
|
I/O Type |
|
COMMON
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
3
|
Number of Ports |
|
2
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
BGA256,16X16,40
|
Peak Reflow Temperature (Cel) |
|
260
|
Standby Current-Max |
|
0.02 A
|
Standby Voltage-Min |
|
2.4 V
|
Supply Current-Max |
|
0.74 mA
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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