CY8CTST110-32LTXI
vs
CY8CTST110-32LTXIT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
5 X 5 MM, 0.93 MM HEIGHT, LEAD FREE, QFN-32
|
5 X 5 MM, 0.93 MM HEIGHT, LEAD FREE, QFN-32
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Boundary Scan |
NO
|
NO
|
| Bus Compatibility |
I2C; USB
|
I2C; USB
|
| Clock Frequency-Max |
24.6 MHz
|
24.6 MHz
|
| JESD-30 Code |
S-XQCC-N32
|
S-XQCC-N32
|
| JESD-609 Code |
e4
|
e4
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of I/O Lines |
28
|
28
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
512
|
512
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
2.4 V
|
2.4 V
|
| Supply Voltage-Nom |
2.7 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
5 mm
|
5 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare CY8CTST110-32LTXI with alternatives
Compare CY8CTST110-32LTXIT with alternatives