CY7C9101-30PC
vs
MAQ17502CB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
GEC PLESSEY SEMICONDUCTORS
Part Package Code
DIP
Package Description
0.900 INCH, PLASTIC, DIP-64
,
Pin Count
64
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Clock Frequency-Max
33.3 MHz
External Data Bus Width
9
16
JESD-30 Code
R-PDIP-T64
R-CDIP-T64
JESD-609 Code
e0
Length
81.28 mm
Number of Terminals
64
64
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP64,.9
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.715 mm
Supply Current-Max
60 mA
35 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
22.86 mm
uPs/uCs/Peripheral ICs Type
BIT-SLICE MICROPROCESSOR
BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
Base Number Matches
1
2
Compare CY7C9101-30PC with alternatives
Compare MAQ17502CB with alternatives