CY7C65630-56LTXCT
vs
ISP1123BD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
QFN
QFP
Package Description
QFN-56
7 X 7 X 1.40 MM, PLASTIC, LQFP-32
Pin Count
56
32
Reach Compliance Code
compliant
unknown
ECCN Code
5A991.B.4.B
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Clock Frequency-Max
24 MHz
6 MHz
External Data Bus Width
JESD-30 Code
S-XQCC-N56
S-PQFP-G32
JESD-609 Code
e3
Length
8 mm
7 mm
Moisture Sensitivity Level
3
Number of Terminals
56
32
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
LQFP
Package Equivalence Code
LCC56,.31SQ,20
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.6 mm
Supply Current-Max
260 mA
Supply Voltage-Max
3.45 V
5.5 V
Supply Voltage-Min
3.15 V
4 V
Supply Voltage-Nom
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
Width
8 mm
7 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, UNIVERSAL SERIAL BUS
BUS CONTROLLER, UNIVERSAL SERIAL BUS
Base Number Matches
2
2
Bus Compatibility
I2C
Data Transfer Rate-Max
1.5 MBps
Compare CY7C65630-56LTXCT with alternatives
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