CY7C65630-56LFXAT
vs
ISP1122D
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
PHILIPS SEMICONDUCTORS
Part Package Code
QFN
Package Description
8 X 8 MM, LEAD FREE, MO-220, QFN-56
SOP, SOP32,.4
Pin Count
56
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Clock Frequency-Max
24 MHz
External Data Bus Width
JESD-30 Code
S-XQCC-N56
R-PDSO-G32
JESD-609 Code
e3
e0
Length
8 mm
Moisture Sensitivity Level
3
Number of Terminals
56
32
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
SOP
Package Equivalence Code
LCC56,.31SQ,20
SOP32,.4
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
Supply Current-Max
260 mA
Supply Voltage-Max
3.45 V
Supply Voltage-Min
3.15 V
Supply Voltage-Nom
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
8 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, UNIVERSAL SERIAL BUS
Base Number Matches
1
2
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