CY7C65620-56LTXCT
vs
ISP1123NB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
QFN
DIP
Package Description
QFN-56
SDIP,
Pin Count
56
32
Reach Compliance Code
compliant
unknown
ECCN Code
5A991.B.4.B
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Clock Frequency-Max
24 MHz
6 MHz
External Data Bus Width
JESD-30 Code
S-XQCC-N56
R-PDIP-T32
JESD-609 Code
e3
Length
8 mm
28.95 mm
Moisture Sensitivity Level
3
Number of Terminals
56
32
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
SDIP
Package Equivalence Code
LCC56,.31SQ,20
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
4.7 mm
Supply Current-Max
260 mA
Supply Voltage-Max
3.45 V
5.5 V
Supply Voltage-Min
3.15 V
4 V
Supply Voltage-Nom
3.3 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
0.5 mm
1.778 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
8 mm
10.16 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, UNIVERSAL SERIAL BUS
BUS CONTROLLER, UNIVERSAL SERIAL BUS
Base Number Matches
2
2
Bus Compatibility
I2C
Data Transfer Rate-Max
1.5 MBps
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