CY7C510-75GMB
vs
ADSP-1010BJG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ROCHESTER ELECTRONICS INC
Part Package Code
PGA
PGA
Package Description
CAVITY-DOWN, CERAMIC, PGA-68
PGA,
Pin Count
68
68
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
Boundary Scan
NO
NO
Clock Frequency-Max
13.3 MHz
External Data Bus Width
16
16
JESD-30 Code
S-CPGA-P68
S-CPGA-P68
JESD-609 Code
e0
e0
Length
27.94 mm
27.81 mm
Low Power Mode
NO
NO
Number of Terminals
68
68
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Data Bus Width
35
35
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Equivalence Code
PGA68,11X11
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
COMMERCIAL
Screening Level
38535Q/M;38534H;883B
Supply Current-Max
110 mA
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
27.94 mm
27.81 mm
uPs/uCs/Peripheral ICs Type
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches
1
2
Pbfree Code
Moisture Sensitivity Level
NOT SPECIFIED
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
4.17 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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