CY7C429-65KMB
vs
5962-8866902ZA
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
E2V TECHNOLOGIES PLC
|
QP SEMICONDUCTOR INC
|
| Package Description |
,
|
QCCN,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
65 ns
|
65 ns
|
| Clock Frequency-Max (fCLK) |
12.5 MHz
|
|
| Cycle Time |
80 ns
|
80 ns
|
| JESD-30 Code |
R-GDFP-F28
|
R-CQCC-N32
|
| Memory Density |
18432 bit
|
18432 bit
|
| Memory IC Type |
OTHER FIFO
|
|
| Memory Width |
9
|
9
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
32
|
| Number of Words |
2048 words
|
2048 words
|
| Number of Words Code |
2000
|
2000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
2KX9
|
2KX9
|
| Output Characteristics |
3-STATE
|
|
| Output Enable |
NO
|
NO
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
QCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Standby Current-Max |
0.025 A
|
|
| Supply Current-Max |
0.115 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
FLAT
|
NO LEAD
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
3
|
4
|
| Additional Feature |
|
RETRANSMIT
|
| JESD-609 Code |
|
e0
|
| Length |
|
13.97 mm
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
3.048 mm
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
11.43 mm
|
|
|
|
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