CY7C274-35DI
vs
CY7C271-35DMB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP,
0.300 INCH, SLIM, CERDIP-28
Pin Count
28
28
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
35 ns
35 ns
Additional Feature
POWER SWITCHED PROM
POWER SWITCHED PROM
JESD-30 Code
R-GDIP-T28
R-GDIP-T28
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Rohs Code
I/O Type
COMMON
JESD-609 Code
e0
Length
37.0205 mm
Package Equivalence Code
DIP28,.3
Programming Voltage
12.5 V
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Standby Current-Max
0.04 A
Supply Current-Max
0.13 mA
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare CY7C274-35DI with alternatives
Compare CY7C271-35DMB with alternatives