CY7C272-25PC
vs
WS57C257-90DMB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
WAFERSCALE INTEGRATION INC
Part Package Code
DIP
Package Description
0.600 INCH, PLASTIC, DIP-40
Pin Count
40
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.71
8542.32.00.61
Access Time-Max
25 ns
90 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDIP-T40
R-XDIP-T40
JESD-609 Code
e0
e0
Memory Density
262144 bit
262144 bit
Memory IC Type
OTP ROM
UVPROM
Memory Width
16
16
Number of Functions
1
Number of Terminals
40
40
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
16KX16
16KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP40,.6
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.2 A
0.0005 A
Supply Current-Max
0.2 mA
0.093 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Screening Level
38535Q/M;38534H;883B
Compare CY7C272-25PC with alternatives
Compare WS57C257-90DMB with alternatives