CY7C261-35PI vs N82HS641BF feature comparison

CY7C261-35PI Cypress Semiconductor

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N82HS641BF NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP, DIP24,.6
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 35 ns 35 ns
Additional Feature POWER SWITCHED PROM
JESD-30 Code R-PDIP-T24 R-GDIP-T24
Memory Density 65536 bit 65536 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 75 °C
Operating Temperature-Min -40 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS BIPOLAR
Temperature Grade INDUSTRIAL COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
JESD-609 Code e0
Package Equivalence Code DIP24,.6
Supply Current-Max 0.175 mA
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm

Compare CY7C261-35PI with alternatives

Compare N82HS641BF with alternatives