CY7C2568KV18-500BZC
vs
IS61DDPB24M18A1-500M3L
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
INTEGRATED SILICON SOLUTION INC
|
Part Package Code |
BGA
|
|
Package Description |
13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
|
LBGA, BGA165,11X15,40
|
Pin Count |
165
|
|
Reach Compliance Code |
unknown
|
compliant
|
Access Time-Max |
0.45 ns
|
0.45 ns
|
Additional Feature |
PIPELINED ARCHITECTURE
|
|
JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B165
|
Length |
15 mm
|
17 mm
|
Memory Density |
75497472 bit
|
75497472 bit
|
Memory IC Type |
DDR SRAM
|
DDR SRAM
|
Memory Width |
18
|
18
|
Number of Functions |
1
|
1
|
Number of Terminals |
165
|
165
|
Number of Words |
4194304 words
|
4194304 words
|
Number of Words Code |
4000000
|
4000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
4MX18
|
4MX18
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
1.4 mm
|
Supply Voltage-Max (Vsup) |
1.9 V
|
1.89 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.71 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
13 mm
|
15 mm
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
Yes
|
ECCN Code |
|
3A991.B.2.A
|
HTS Code |
|
8542.32.00.41
|
Clock Frequency-Max (fCLK) |
|
500 MHz
|
I/O Type |
|
COMMON
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
BGA165,11X15,40
|
Standby Current-Max |
|
0.36 A
|
Standby Voltage-Min |
|
1.7 V
|
Supply Current-Max |
|
0.91 mA
|
Technology |
|
CMOS
|
|
|
|
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