CY7C225-40DI
vs
AM27S25LCB-S
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
DIP
|
QLCC
|
| Package Description |
DIP,
|
QCCN, LCC28,.45SQ
|
| Pin Count |
24
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
25 ns
|
120 ns
|
| JESD-30 Code |
R-GDIP-T24
|
S-CQCC-N28
|
| Memory Density |
4096 bit
|
131072 bit
|
| Memory IC Type |
UVPROM
|
OTP ROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
28
|
| Number of Words |
512 words
|
512 words
|
| Number of Words Code |
512
|
16000
|
| Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
512X8
|
16KX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
QCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL EXTENDED
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Length |
|
11.43 mm
|
| Package Equivalence Code |
|
LCC28,.45SQ
|
| Seated Height-Max |
|
1.905 mm
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
11.43 mm
|
|
|
|
Compare CY7C225-40DI with alternatives
Compare AM27S25LCB-S with alternatives