CY7C199B-20ZC
vs
WS128K32-45HSME
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
WHITE ELECTRONIC DESIGNS CORP
Part Package Code
TSOP
Package Description
TSOP-28
1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Pin Count
28
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
45 ns
I/O Type
COMMON
JESD-30 Code
R-PDSO-G28
S-CPGA-P66
JESD-609 Code
e0
Length
11.8 mm
30.1 mm
Memory Density
262144 bit
4194304 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
8
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
28
66
Number of Words
32768 words
262144 words
Number of Words Code
32000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
256K16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
TSOP1
PGA
Package Equivalence Code
TSSOP28,.53,22
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
6.22 mm
Standby Current-Max
0.01 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.15 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
PIN/PEG
Terminal Pitch
0.55 mm
2.54 mm
Terminal Position
DUAL
PERPENDICULAR
Width
8 mm
30.1 mm
Base Number Matches
1
2
Additional Feature
USER CONFIGURABLE AS 128K X 32
Alternate Memory Width
8
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
MIL-STD-883
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare CY7C199B-20ZC with alternatives
Compare WS128K32-45HSME with alternatives