CY7C192-15PC
vs
MCM6209CP15
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
0.300 INCH, PLASTIC, MO-095, DIP-28
DIP, DIP28,.3
Pin Count
28
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
15 ns
15 ns
Additional Feature
AUTOMATIC POWER-DOWN
I/O Type
SEPARATE
COMMON
JESD-30 Code
R-PDIP-T28
R-PDIP-T28
JESD-609 Code
e0
e0
Length
34.67 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Functions
1
Number of Ports
1
Number of Terminals
28
28
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64KX4
64KX4
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.3
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.82 mm
Standby Current-Max
0.01 A
0.02 A
Standby Voltage-Min
4.5 V
4.5 V
Supply Current-Max
0.145 mA
0.155 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
3
Power Supplies
5 V
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