CY7C1525KV18-333BZXC
vs
GS8662DT11BD-350I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
INFINEON TECHNOLOGIES AG
GSI TECHNOLOGY
Reach Compliance Code
compliant
compliant
Factory Lead Time
11 Weeks
24 Weeks
Access Time-Max
0.45 ns
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE; IT ALSO OPERATES AT 1.5V
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
333 MHz
I/O Type
SEPARATE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e1
Length
15 mm
15 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
QDR II SRAM
QDR SRAM
Memory Width
9
9
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
8MX9
8MX9
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Standby Voltage-Min
1.7 V
Supply Current-Max
0.79 mA
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
NOT SPECIFIED
Width
13 mm
13 mm
Base Number Matches
1
2
Part Package Code
BGA
Package Description
LBGA,
Pin Count
165
ECCN Code
3A991.B.2.B
HTS Code
8542.32.00.41
Compare CY7C1525KV18-333BZXC with alternatives
Compare GS8662DT11BD-350I with alternatives