We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

CY7C1515KV18-300BZCT vs GS8662D36E-300T feature comparison

CY7C1515KV18-300BZCT Cypress Semiconductor

Buy Now Datasheet

GS8662D36E-300T GSI Technology

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP GSI TECHNOLOGY
Package Description 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 15 X 17 MM, 1 MM PITCH, FPBGA-165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 300 MHz 300 MHz
I/O Type SEPARATE SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0
Length 15 mm 17 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type STANDARD SRAM DDR SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX36 2MX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40 BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 235
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.5 mm
Standby Voltage-Min 1.7 V 1.7 V
Supply Current-Max 0.79 mA 0.95 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 13 mm 15 mm
Base Number Matches 1 1
Part Package Code BGA
Pin Count 165
Memory » SRAMs
Memory » SRAMs

Compare CY7C1515KV18-300BZCT with alternatives

Compare GS8662D36E-300T with alternatives