CY7C1514KV18-250BZC
vs
IS61QDB22M36-250M3L
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INFINEON TECHNOLOGIES AG
INTEGRATED SILICON SOLUTION INC
Reach Compliance Code
compliant
compliant
Factory Lead Time
4 Weeks
Memory IC Type
QDR II SRAM
DDR SRAM
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
BGA
Package Description
LBGA, BGA165,11X15,40
Pin Count
165
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
250 MHz
I/O Type
SEPARATE
JESD-30 Code
R-PBGA-B165
JESD-609 Code
e1
Length
17 mm
Memory Density
75497472 bit
Memory Width
36
Number of Functions
1
Number of Terminals
165
Number of Words
2097152 words
Number of Words Code
2000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
2MX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.4 mm
Standby Voltage-Min
1.7 V
Supply Current-Max
0.7 mA
Supply Voltage-Max (Vsup)
1.89 V
Supply Voltage-Min (Vsup)
1.71 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
10
Width
15 mm
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