CY7C1513AV18-250BZC
vs
GS8662D18E-250T
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
15 X 17 MM, 1 MM PITCH, FPBGA-165
Pin Count
165
165
Reach Compliance Code
unknown
compliant
Access Time-Max
0.45 ns
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
17 mm
17 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
QDR SRAM
DDR SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4MX18
4MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.4 mm
1.5 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
15 mm
15 mm
Base Number Matches
2
1
Pbfree Code
Rohs Code
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Clock Frequency-Max (fCLK)
250 MHz
I/O Type
SEPARATE
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Package Equivalence Code
BGA165,11X15,40
Peak Reflow Temperature (Cel)
235
Standby Voltage-Min
1.7 V
Supply Current-Max
0.775 mA
Technology
CMOS
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