CY7C150-12DC vs CY8C150-25DMB feature comparison

CY7C150-12DC Cypress Semiconductor

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CY8C150-25DMB Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP
Package Description 0.300 INCH, CERDIP-24
Pin Count 24
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 25 ns
I/O Type SEPARATE SEPARATE
JESD-30 Code R-GDIP-T24 R-XDIP-T24
JESD-609 Code e0 e0
Length 31.877 mm
Memory Density 4096 bit 4096 bit
Memory IC Type CACHE SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1
Number of Ports 1
Number of Terminals 24 24
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 1KX4 1KX4
Output Characteristics 3-STATE 3-STATE
Output Enable YES
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.09 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.09 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1
Screening Level 38535Q/M;38534H;883B

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