CY7C1487V33-133BGC
vs
GS8644V72GC-166I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
14 X 22 MM, 1.76 MM HEIGHT, PLASTIC, FBGA-209
LBGA,
Pin Count
209
209
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
6.5 ns
7 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE
PIPELINED OR FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK)
133 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B209
R-PBGA-B209
JESD-609 Code
e0
e1
Length
22 mm
22 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
72
72
Number of Functions
1
1
Number of Terminals
209
209
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1MX72
1MX72
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA209,11X19,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.96 mm
1.7 mm
Standby Voltage-Min
3.14 V
Supply Voltage-Max (Vsup)
3.6 V
2 V
Supply Voltage-Min (Vsup)
3.135 V
1.6 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
14 mm
Base Number Matches
1
1
Pbfree Code
Moisture Sensitivity Level
3
Compare CY7C1487V33-133BGC with alternatives
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