CY7C1485V25-200BZC vs CY7C1485V25-200AXI feature comparison

CY7C1485V25-200BZC Cypress Semiconductor

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CY7C1485V25-200AXI Cypress Semiconductor

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA QFP
Package Description 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 LQFP, BGA165,11X15,40
Pin Count 165 100
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3 ns 3 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz 200 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B165 R-PQFP-G100
JESD-609 Code e0 e1
Length 17 mm 20 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 165 100
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4MX18 4MX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LQFP
Package Equivalence Code QFP100,.63X.87 BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 220 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.6 mm
Standby Voltage-Min 2.38 V 2.38 V
Supply Voltage-Max (Vsup) 2.625 V 2.625 V
Supply Voltage-Min (Vsup) 2.375 V 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.65 mm
Terminal Position BOTTOM QUAD
Width 15 mm 14 mm
Base Number Matches 1 1
Time@Peak Reflow Temperature-Max (s) 20

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