CY7C1485V25-167AXC vs GS8641ZV18F-300T feature comparison

CY7C1485V25-167AXC Cypress Semiconductor

Buy Now Datasheet

GS8641ZV18F-300T GSI Technology

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP GSI TECHNOLOGY
Part Package Code QFP BGA
Package Description LQFP, BGA165,11X15,40 BGA,
Pin Count 100 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.4 ns 5.5 ns
Additional Feature PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 167 MHz
I/O Type COMMON
JESD-30 Code R-PQFP-G100 R-PBGA-B165
JESD-609 Code e1
Length 20 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type CACHE SRAM ZBT SRAM
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 100 165
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4MX18 4MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP BGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 235
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm
Standby Voltage-Min 2.38 V
Supply Voltage-Max (Vsup) 2.625 V 2 V
Supply Voltage-Min (Vsup) 2.375 V 1.6 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm
Base Number Matches 1 1

Compare CY7C1485V25-167AXC with alternatives

Compare GS8641ZV18F-300T with alternatives